SIASUN TSS-3000 EFEM (TSS-3000)
In stock
- BRAND:
- SIASUN
- PART #:
- TSS-3000
- ORIGIN:
- China
- AVAILABILITY:
- SUBJECT TO AVAILABILITY
- SKU:
- SIASUN-TSS-3000
SIASUN TSS-3000 EFEM (TSS-3000)
A wafer is the most expensive thing a person should never touch, yet every fab has to move it, align it and hand it on dozens of times. The SIASUN TSS-3000 EFEM (TSS-3000) exists for that quiet, repetitive moment at the front of a process tool, where the wafer leaves its carrier and begins its work.
This product is available through this page, by quotation.
Background
SIASUN and the front-end module
SIASUN is a robotics manufacturer whose range, as listed in our SIASUN category, runs from heavy-duty mobile robots to electronics automation. The TSS-3000 belongs to its semiconductor handling line. An EFEM, or Equipment Front End Module, is the wafer front-end transfer device that sits between the factory's carrier transport and the process tool. The TSS-3000 is a SEMI-compatible interface system, which means it is built to meet the interface conventions that wafer equipment in a fab relies on.
A TSS-2000 is named as another version in the line. The figures on this page belong to the TSS-3000 only, and nothing here should be read as describing the TSS-2000.
Positioning and key technology
The TSS-3000 takes wafers horizontally from carriers, either by hand or together with an MR or OHT carrier transport. Its footprint is small. Its robot is a dual-arm manipulator with an external axis, and it picks and places wafers through combined motion on two axes. This raises wafer transfer efficiency while lowering maintenance cost.
Inside, a new gas-guiding structure keeps the interior at ISO Class 1 cleanliness. Several layers of interlock protection, from software to hardware, look after the wafer, the people and the equipment. The atmospheric hand, the aligner, the SMIF and the buffer are all developed in-house by SIASUN, and they are built for high stability.
Technical Specifications
| Specification | Value |
|---|---|
| Product type | Wafer front-end transfer device; SEMI-compatible interface system |
| Robot | Dual-arm manipulator with external axis, pick and place by combined two-axis motion |
| Carrier handling | Horizontal wafer transfer, manual or together with MR or OHT carriers |
| Cleanliness class | class 1 (internal space meets ISO Class 1) |
| Dimensions | 2100*750*2500mm |
| Weight | ≤1100kg |
| Wafer placement position accuracy | ±0.1mm |
| Wafer placement angle accuracy | ±0.2° |
| Safety | Multiple interlocks, software and hardware |
| Core components | Atmospheric hand, aligner, SMIF and buffer, all developed in-house |
| Customization | Non-standard customization to the user's actual needs |
Specifications as published by the manufacturer; confirmed against the datasheet at quotation.
The manufacturer has not published the wafer sizes this model supports, the number of load ports, the power requirements, the compressed air and vacuum requirements, the communication interface or the contents of the box; they are confirmed at quotation.
What does the dual-arm robot with an external axis bring to wafer transfer?
A front-end module lives or dies by how smoothly its robot moves wafers. On the TSS-3000 the manipulator has two arms and an external axis. Wafers are picked and placed through combined motion on two axes, which is what raises transfer efficiency and lowers the cost of keeping the product running.
The accuracy figures give the buyer something concrete to check. Position of wafer placement is ±0.1mm and angle is ±0.2°. These are the numbers a process engineer will compare against the tool's own tolerance for hand-off, and they are worth raising when we prepare your quotation.
How clean is the inside of the TSS-3000?
Contamination is the constant worry in wafer handling. The TSS-3000 uses a new internal gas-guiding structure, and the interior meets ISO Class 1 cleanliness, listed in the table as class 1. The aim is a clean environment throughout wafer transfer.
Cleanliness is not the only protection. Interlocks run from software down to hardware, so that the wafer, the operator and the equipment are covered during transfer. For a maintenance team, this layered approach matters as much as the cleanliness figure itself.
Who is the SIASUN TSS-3000 EFEM for?
The first group is the equipment maker that needs a front-end module to pair with its own process tool. A SEMI-compatible interface system with in-house core parts is a practical starting point for such an integration, and the option of non-standard customization helps where the tool has unusual requirements.
The second group is the fab or lab project team that wants wafers moved horizontally from carriers, whether an operator loads them by hand or an MR or OHT carrier transport delivers them. The third group is the facility with limited floor space, since the module has a small footprint. For broader factory automation, such as electronics assembly, you may also look at the SIASUN 3C Electronics Automation Solutions.
Buyers who need a particular wafer size, load port count or communication standard should raise it when they request a quotation.
What is the SIASUN TSS-3000 EFEM used for?
- Front-end wafer transfer: moving wafers between the carrier and the process tool's entry point.
- Manual carrier loading: horizontal wafer transfer when an operator places the carrier.
- Automated carrier handling: working together with MR or OHT carrier transport.
- Wafer alignment: using the in-house aligner to set the wafer's position and angle before hand-off.
- Clean transfer: keeping the wafer in an ISO Class 1 interior while it moves.
- Custom tool integration: adapting the module to a user's non-standard requirement.
Pricing and Availability
We do not print prices on this page. A quotation is the way to proceed, and it lets us set out the configuration you need. Delivery, customs and support are arranged together with the quotation. The SIASUN TSS-3000 EFEM (TSS-3000) is available on this page.
Frequently Asked Questions
What is the SIASUN TSS-3000 EFEM?
It is a wafer front-end transfer device and a SEMI-compatible interface system. It moves wafers horizontally, by hand or together with MR or OHT carriers.
What are its dimensions and weight?
The dimensions are 2100*750*2500mm, and the weight is ≤1100kg.
How accurately does it place wafers?
Position accuracy is ±0.1mm and angle accuracy is ±0.2°.
What cleanliness level does it reach?
The internal space meets ISO Class 1, listed as class 1. A new gas-guiding structure supports this.
Can it be customized?
Yes. Non-standard customization is possible to suit the user's actual needs.
Which wafer sizes and how many load ports does it support?
These details are not part of the information available for this model. Ask for them with your quotation, along with power, air and vacuum requirements and the communication interface.
Where can I buy the SIASUN TSS-3000 EFEM and what does it cost?
You can request it through this page, by quotation. We do not list prices; the quotation sets out the configuration, delivery, customs and support.
Summary
The wafer is the valuable item, and the front-end module is where it is handled with the most care. The TSS-3000 combines a dual-arm robot with an external axis, ISO Class 1 cleanliness, layered interlocks and in-house core parts in a small footprint, with placement accuracy of ±0.1mm and ±0.2°. If that matches your tool or fab project, this page is the starting point.
